发明名称 COOLANT HOUSING UNIT OF SEMICONDUCTOR ETCHING EQUIPMENT
摘要 PURPOSE: A coolant housing unit of a semiconductor etching equipment is provided to easily make a bearing assembled/dissembled into/from a housing, by having a small portion of the bearing contact the housing. CONSTITUTION: A coolant housing unit of a semiconductor etching equipment comprises a bearing(30), a housing and a holder(40). The housing is connected to a cooling water line, including an upper surface and a bottom surface, and having the first space on the bottom surface and the second space connected to the first space. The bearing is inserted in the second space. The holder is coupled/detached to/from the inner surface of the first space in a screw type, and supports an end of the bearing inserted in the second space. The holder further comprises a male screw on its outer surface, the third space on its upper space and a groove on its bottom surface. An end of the bearing inserted in the second space of the holder is inserted into the third space when the holder is coupled to the housing. A tool is put into the groove so that the holder is assembled and dissembled. If the holder is detached, the bearing is easily dissembled because a contact portion between the housing and the bearing is small.
申请公布号 KR20010002455(A) 申请公布日期 2001.01.15
申请号 KR19990022269 申请日期 1999.06.15
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM, IN HEON
分类号 H01L21/306;(IPC1-7):H01L21/306 主分类号 H01L21/306
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