| 摘要 |
PURPOSE: A wafer level package and a method for fabricating the same are provided to reduce the manufacturing cost of the package by removing the deposition process. CONSTITUTION: A wafer level package comprises a semiconductor chip formed on a surface thereof with bonding pads. A conductive bump(11) is formed on the bonding pads. An insulation adhesive(20) is coated on the surface of the semiconductor chip so as to expose the conductive bump(11). A lead frame(30) having a plurality of filling recesses is bonded to the surface of the semiconductor chip. An underside of the lead frame(30) is electrically connected to the conductive bump(11). An insulation layer(50) formed with a ball land for exposing the lead frame(30) is coated on the upper portion of the lead frame(30) so as to bury the filling recesses. An auxiliary adhesive layer(60) is formed on the ball land. A solder ball(70) is mounted on the auxiliary adhesive layer(60).
|
