发明名称 |
ELECTROSTATIC CHUCK WITH IMPROVED TEMPERATURE CONTROLLING PERFORMANCE |
摘要 |
PURPOSE: An electrostatic chuck with an improved temperature controlling performance is to relatively lengthen a staying time of a temperature controlling gas at an edge of a wafer, thereby equally controlling the temperature of an entire wafer. CONSTITUTION: An electrostatic chuck(100) with an improved temperature controlling performance comprises a temperature controlling gas supplying pipe(120) disposed at the inside of the electrostatic chuck and having an entrance/discharging port(140) at the edge side of a surface of the electrostatic chuck on which a wafer(20) is mounted; and a temperature controlling gas discharging pipe disposed at the inside of the electrostatic chuck and having an intake port for sucking temperature controlling gas leaked from the entrance/discharging port. In the chuck, the roughness at the edge side of the surface of the electrostatic chuck is bigger than that at a center portion of the surface so that a discharging speed of the temperature controlling gas may be slowed down at the edge side of the surface. The roughness of the surface of the electrostatic chuck is formed by a plurality of protrusions formed on the surface.
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申请公布号 |
KR20010002277(A) |
申请公布日期 |
2001.01.15 |
申请号 |
KR19990022012 |
申请日期 |
1999.06.14 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JANG, TAE HO |
分类号 |
H01L21/68;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/68 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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