发明名称 THREE DIMENSIONAL COMPOSITE CUBIC CIRCUIT BOARD
摘要 PURPOSE: A three dimensional composite cubic circuit board is provided to reduce a time for mounting, make size of electronic products miniaturized, save a production cost, and minimize influence of electromagnetic wave on human bodies. CONSTITUTION: After electronic components are mounted inside the first circuit board(10), surfaces A, D and a bottom surface of the first circuit board(10) are bonded together. The second and third circuit boards(20,30) manufactured in the same manner as the first circuit board(10) are consecutively inserted inside a space part of the first circuit board(10). Terminal parts of the circuit boards are connected to a flexible substrate. The second circuit board(20) connected to the first circuit board(10) is eccentrically coupled to one side such that a space is formed between the first circuit board and the second circuit board(20) to discharge heat generated in the first and second circuit boards. The third circuit board(30) is eccentrically coupled relative to the second circuit board(20). A fixing part(12) extending in the surfaces A and C is fixed to a case of the electronic components, thereby reducing a space where the circuit boards are mounted.
申请公布号 KR100270869(B1) 申请公布日期 2001.01.15
申请号 KR19970052014 申请日期 1997.10.10
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JANG, GYEONG U
分类号 H05K9/00;H05K1/02;H05K1/14;H05K1/18;H05K7/02;(IPC1-7):H05K3/46 主分类号 H05K9/00
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