发明名称 MANUFACTURE OF URETHANE MOLDING FOR POLISHING PAD, AND URETHANE MOLDING FOR POLISHING PAD
摘要 <p>PURPOSE: A urethane molding are provided to improve the polishing characteristic of a polishing pad and to reduce the dispersion of the polishing characteristic of polishing pads by mixing the specific quantity of water in a mixture of expanded micro hollow spheres, an isocyanate radical end urethane prepolymer and an active hydrogen contained compound to form bubbles by water. CONSTITUTION: Water is mixed at 0.005-0.5 wt.% in a mixture of expanded micro hollow spheres, an isocyanate radical end urethane prepolymer and an active hydrogen contained compound to form bubbles by water in a molding. The expanded micro hollow spheres are formed by expanding heat- expansive micro spheres formed out of thermoplastic resin, by heating. The isocyanate prepolymer is a reactant obtained from polyol or a mixture of polyol and low molecular weight diol, and an organic diisocyanate compound under normally applied reaction conditions. 3, 3'-dichloro-4,4' diaminophenylmethane or the like is used as the active hydrogen contained compound.</p>
申请公布号 KR20010005435(A) 申请公布日期 2001.01.15
申请号 KR19990035130 申请日期 1999.08.24
申请人 FUJI SPINNING CO., LTD. 发明人 KIHARA KATSUSHI;MOCHIZUKI YOSHIMI
分类号 C08G18/70;C08G18/12;C08G18/48;C08G18/66;C08J9/32;(IPC1-7):C08G18/70 主分类号 C08G18/70
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