发明名称 |
METHOD FOR FORMING SOG IN MANUFACTURING PROCESS OF SEMICONDUCTOR |
摘要 |
PURPOSE: A method for forming an SOG(Spin On Glass) in a manufacturing process of a semiconductor is provided to reduce a time necessary for an over-process of an SOG. CONSTITUTION: A method for forming an SOG in a manufacturing process of a semiconductor comprises the following steps. The method separates a furnace process from a coating process. A wafer is loaded on a spinner(15) and an SOG is applied thereon. A rinsing process is performed. A bake process is performed continuously within a bake plate(17) according to each step. In the bake process, a hard bake process is performed according to the number of wafer provided to a boat(21) independently of a coating process.
|
申请公布号 |
KR20010003128(A) |
申请公布日期 |
2001.01.15 |
申请号 |
KR19990023291 |
申请日期 |
1999.06.21 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AHN, CHEOL BEOM |
分类号 |
H01L21/31;(IPC1-7):H01L21/31 |
主分类号 |
H01L21/31 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|