发明名称 METHOD FOR FORMING SOG IN MANUFACTURING PROCESS OF SEMICONDUCTOR
摘要 PURPOSE: A method for forming an SOG(Spin On Glass) in a manufacturing process of a semiconductor is provided to reduce a time necessary for an over-process of an SOG. CONSTITUTION: A method for forming an SOG in a manufacturing process of a semiconductor comprises the following steps. The method separates a furnace process from a coating process. A wafer is loaded on a spinner(15) and an SOG is applied thereon. A rinsing process is performed. A bake process is performed continuously within a bake plate(17) according to each step. In the bake process, a hard bake process is performed according to the number of wafer provided to a boat(21) independently of a coating process.
申请公布号 KR20010003128(A) 申请公布日期 2001.01.15
申请号 KR19990023291 申请日期 1999.06.21
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AHN, CHEOL BEOM
分类号 H01L21/31;(IPC1-7):H01L21/31 主分类号 H01L21/31
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