发明名称 APPARATUS FOR TESTING IMAGE SENSOR CHIP
摘要 PURPOSE: An apparatus for testing an image sensor chip is provided to rapidly test a characteristic of the image sensor chip by simply establishing only the chip in a jig without an additional soldering process for fixing the chip to a board. CONSTITUTION: An apparatus for testing an image sensor chip comprises a base body(1), a front base, a main board, a socket assembly(8) and a group of lenses. The base body is supported by a bottom surface. The front base has a supporting groove and a supporting hole having different sizes inside, established on the base body. The main board transfers an image signal to an external monitor, built in the front base. The socket assembly is inserted into the supporting hole at a side of the front base to be electrically connected to the main board, having the image sensor chip inside. The group of lenses inspects an image of the image sensor chip, located in a position opposite to the socket assembly.
申请公布号 KR20010004196(A) 申请公布日期 2001.01.15
申请号 KR19990024816 申请日期 1999.06.28
申请人 HYNIX SEMICONDUCTOR INC. 发明人 HUH, OK;KANG, SANG HUN
分类号 H01L27/14;H01L31/00;(IPC1-7):H01L31/00 主分类号 H01L27/14
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