OVERLAPPING MARK IN SEMICONDUCTOR DEVICES AND METHOD FOR FORMING THE SAME

摘要

PURPOSE: An overlapping mark in semiconductor devices and method for forming the same are provided to be capable of easily measuring the overlapping degree because the center of the circle does not change when a metal layer for metal wiring is expanded. CONSTITUTION: An overlapping mark includes a mother stick(13') of an outer box and a circular shape and a son stick(17) of an inbox at the center of the outer box. The mother stick is formed by etching metal wiring material layers using the first photosensitive film pattern(15) as a mask and then removing the first photosensitive film pattern. Also, the son stick is formed on the oxide film filling between the metal wiring material layers.