| 摘要 |
PURPOSE: A screw cleaning apparatus for manufacturing a semiconductor device is provided to automatically clean contamination materials adhered to a screw while applying grease on the cleaned screw. CONSTITUTION: A screw cleaning apparatus for manufacturing a semiconductor device comprises a screw, a cleaning tip(310), a suction hole, a suction hose(391), a spraying hole and a supplying hose(395). The screw moves a stage. A front end of the cleaning tip contacts the screw, and scratches contamination material on the surface of the screw by sliding along the surface of the screw. The suction hole is established near the front end of the cleaning tip and eliminates the scratched contamination material. The suction hose transfers and exhausts the sucked contamination material through the suction hole. The spraying hole sprays grease on the surface from which the sucked contamination material is eliminated, established near the front end of the cleaning tip and opposite to the suction hole. The supplying hose supplies the grease through the suction hole.
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