| 摘要 |
PROBLEM TO BE SOLVED: To manufacture at a low cost a transfer bump sheet capable of transferring repairable bumps en bloc to a semiconductor chip. SOLUTION: A transfer bump sheet 1 having conductor terminals 3 composed of a solder layer 6 and two metal layers 5, 4 formed on a base sheet 2 is manufactured by executing steps of forming the metal layer 4 to be a part of the conductor terminals on one surface of a metal foil 7 by electroplating or electroless plating, forming the solder layer 6 on the other surface, forming the base sheet 2 on the surface of the metal foil 7 having the solder layer 6, and etching the metal foil 7 with the formed metal layer 4 used as an etching mask to form the metal layer 5 of the conductor terminals 3.
|
