| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic apparatus in which deformation such as warpage is difficult to form and which has structure proper to recycling treatment. SOLUTION: A plurality of lower holes 1a, 1b are bored to a metal plate 1 as the framework of the box body of the electronic apparatus, and hooks 2a, 2b integrally molded on the backside of a molding part 2 as the external facing of the box body are installed to each of the lower holes one by one. The lower hole 1b at a center constrains the movement of the hook 2b in an xy plane. Sliding regions for moving the hooks 2a in the direction (the direct towards the fixed hook 2b) towards the center of the mold shrinkage of the molding part 2 are ensured in other lower holes 1a. A boss hole 2c for a mounting screw is formed to the head section of at least one sliding hook 2a. A screw for fixing a part housed in the box body is fitted into the boss hole 2c.
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