| 摘要 |
PROBLEM TO BE SOLVED: To uniformly clean the entire surface of a substrate to be cleaned. SOLUTION: This apparatus includes a mechanism 1 for holding a substrate W, a motor 4 for rotating the mechanism 1, and a mechanism 5 for supplying a flow Q of a cleaning solution to flow continuously along the cleaning surface of the substrate W from one end of the substrate W held in the mechanism 1 toward the other end thereof. In this case, the mechanism 1 having the substrate W held therein is rotated, while the continuous cleaning solution flow Q is supplied to the substrate W, at which time the supply conditions of the solution flow Q and the rotational conditions of the substrate W are adjusted, so that the flow Q passes through a rotary center WJ of the cleaning surface of the substrate W, thus cleaning the cleaning surface of the substrate W with the cleaning solution.
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