| 摘要 |
PROBLEM TO BE SOLVED: To enhance the productiyity by removing the waiting time of a bonding head. SOLUTION: In a wire bonding method which performs wire bonding using a capillary for a plurality of semiconductor pellet rows (A row to D row) existing within a bonding area BA, a semiconductor pellet 60 is carried by a specified quantity of carriage each time the capillary is shifted to other semiconductor pellet row (for example, B row) after completion of boding operation to one row (for example, A row) among the plural semiconductor pellet rows. |
