| 摘要 |
PROBLEM TO BE SOLVED: To prevent warpage of a semiconductor integrated circuit device by arranging first sealing resin for sealing a semiconductor chip and wiring at a first main surface side and at the same time, sealing a second main surface side where a plurality of leads are formed with second sealing resin. SOLUTION: After a brazing material 4 that is a liquid adhesive material of a solvent volatile type at a die attach, a semiconductor chip 5 is mounted before the brazing material 4 is cured for curing the brazing material 4, and the semiconductor chip 5 is sealed to the die attach 3. Then, the semiconductor chip 5 and a lead 1 are electrically connected via metal wiring 6, so that an electrical signal can be inputted or outputted from the outside of the semiconductor integrated circuit device to the semiconductor chip 5 via the lead 1. After that, the reverse side of the die attach 3, where no semiconductor chips 5 are mounted, is sealed by second sealing resin 8, thus preventing warpage of the semiconductor integrated circuit device. |
