| 摘要 |
PROBLEM TO BE SOLVED: To enable non-destructive inspection on the basis of the non-contact type measuring system for the distance between the conductive layers of a ceramic multilayer substrate formed with the baking at a time. SOLUTION: On a green sheet 1 used as a base, a green sheet 2 having providing a through-hole of 5 mm square is laminated at the end part of the green sheet 1, a green sheet 3 providing a through-hole of 7 mm square is then laminated, a green sheet 4 providing a through-hole of 9 mm square is then laminated, a green sheet 5 providing a through-hole of 11 mm square is then laminated, a green sheet 6 providing a through-hole of 13 mm square is then laminated, a green sheet 7 providing a through-hole of 15 mm square is then laminated, and a green sheet 8 providing a through-hole of 17 mm square is then laminated. Thereafter, a ceramic multilayer wiring board body 10 is then formed with the green sheet baking process. |
