| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an insulating protective layer for a circuit, very easily, which is excellent in work precision and reliability. SOLUTION: Film-like laminated bodies comprising at least a photo-sensitized resin layer 2 and polyimide precursor resin layer 3 are so laminated on a circuit board 5 that the polyimide precursor resin layer 3 contacts the circuit board 5, which is processed with exposure, development, etching, release of remaining photo-sensitized resin layer, and solidification of a patterned polyimide precursor resin layer, providing a circuit board comprising a patterned insulating protective film 5. |
