| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring tape for BGA where the defect of the adhesion property of solder resist in BGA can be reduced, and to provide the structure of a semiconductor device using the tape. SOLUTION: In a wiring tape for BGA, solder resist 18 or photosensitive solder resist is formed on a TAB tape 1 where a copper pattern having ball pads 8 receiving solder balls, pads which do not receive the solder balls and circuits which electrically connect the pads is formed, chips are loaded on solder resist 18 and resin is molded. A copper pattern non-forming part 12 is installed so that the copper pattern forming the circuit is not formed at the peripheral part of a pad which does not receive the solder balls. |
