发明名称 LSI-PACKAGED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To reduce the packaging space of the packaged circuit board and to cope with specification changes in a termination condition by packaging a termination LSI constituted, so that a program element can select a plurality of kinds of termination circuits, onto the circuit board. SOLUTION: Various LSIs (FPGA, gate array, customer LSI or the like) 12a, 12b, 12c, 12d having various interface circuits (TTL, CMOS, GTL, CTT, ECL) are packaged in a printed-circuit board 17, and a termination LSI 19 that is configured independently of the LSIs 12a-12d is packaged between output pins 13 of the LSIs 12a, 12b and input pins 16 of the LSIs 12c, 12d. A data ROM 18 enters programmable data to a program element in the termination LSI 19 to write the data to the program element, which individually selects a termination condition desired between the LSIs, that have various interfaces and changes the specification of the termination condition.
申请公布号 JP2001007692(A) 申请公布日期 2001.01.12
申请号 JP19990175675 申请日期 1999.06.22
申请人 HITACHI LTD 发明人 ITAGAKI TATSUYA;TONOZUKA TAROU
分类号 H03K19/0175;(IPC1-7):H03K19/017 主分类号 H03K19/0175
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