METHOD FOR ASSEMBLING SUBSTRATE AND APPARATUS THEREFOR

摘要

PROBLEM TO BE SOLVED: To match marks to each other with high accuracy and to bond substrates to each other by moving one vacuum chamber unit with respect to the other to position the substrates to each other and narrowing the opposite spacing thereof, thereby bonding the substrates to each other. SOLUTION: A substrate bonding section S2 is composed of the structure that an upper chamber unit 21 and a pressurizing plate 27 therein can respectively independently move vertically. Namely, the upper chamber unit 21 has a housing 30 containing a linear bushing and a vacuum seal and is moved in a vertical Z-axis direction by the shaft of a cylinder 22 fixed to a frame 3. When the upper chamber unit 21 descends, a flange of the upper chamber unit 21 comes into contact with an O-ring 44 arranged around a lower chamber 10 and mates therewith, thereby attaining the state that the units function as a vacuum chamber. As a result, the alignment marks disposed at the respective substrates may be aligned to each other with the high accuracy and the substrates are rapidly bonded to each other.