| 摘要 |
PROBLEM TO BE SOLVED: To facilitate the miniaturization of electronic parts provided with communication function, and to make a semiconductor device easily applicable to various kinds of electronic equipment by integrally forming a semiconductor element and an antenna and mounting the antenna, on which a covered wire is wound, within the plane area of the electrode terminal forming surface of the semiconductor element in the state of electrically connecting the terminal part of the antenna to the electrode terminal of the semiconductor element. SOLUTION: A semiconductor device 20 is to be used for the responder such as a non-contact IC card, e.g. and has a structure of integrally forming a semiconductor element 22 and an antenna 24 for transmitting and receiving a signal. To be specific, the antenna 24 formed on a coil by closely winding a covered wire 30 coated with an insulated material within the plane area A of the electrode terminal forming surface 22a of the element 22 in the state of electrically connecting the terminal part 24a of the antenna 24 to the electrode terminal 26 of the element 22. Then, the antenna 24 is sealed with a resin material 28 covering the whole of the surface 22a of the element 22 including the antenna 24. |
