| 摘要 |
PROBLEM TO BE SOLVED: To drive an optical element at high speed and to stabilize the characteristic of the optical element, by a method wherein one part out of electrodes of the optical element is connected directly to an electrode on an electric element by using a flip-chip bump, and the remaining part is connected directly to an electrode on a substrate by using a flip-chip bump. SOLUTION: In this optical-electrical mixedly mounted module, a mounting board 1 which is hollowed partly, an electric element 2 which is die-bonded to the bottom face of its hollowed part; and an optical element 3 which strides over the electric element 2 and the mounting board 1, and which is connected to an electrode pad on the surface of the electric element 2 and to an electrode pad on the mounting board 1 via bumps 4; are provided as fundamental constitutions. In addition, an electric element 5 whose function is separate from that of the electric element 2 which drives the optical element 3 is connected electrically to the mounting board 1 and the electric element 2 via bumps 6. By this structure, since the electric element 2 and the optical element 3 are connected directly by using the bumps 4, the length of electric interconnections between both elements becomes a short length only as the diameter of the bumps, and the optical element 3 can be operated at high speed.
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