| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device, together with its manufacturing method, wherein automation of manufacture is easy with good work efficiency for cleaning, based on the technology using a die and mold. SOLUTION: A heat-radiation plate 7 and a laminated board 31 are aligned above a mold 82 for mounting, and a die 82 is lowered before fixing. A thermo- setting resin 11 is injected into a cavity 61 from a resin injection opening 17, and a preliminary heating is performed to preliminarily solidify the resin 11. Thus, in a resin injection process for manufacturing a semiconductor device, no plate is used for resin injection. No issue of levelness with the heat radiation plate 7 and laminated board 31 which occurs in potting method takes place for injecting a resin. |
