| 摘要 |
PROBLEM TO BE SOLVED: To provide an apparatus for quickly rinsing and drying a semiconductor substrate with high reliability. SOLUTION: This spin dryer has a shielding system, positioned to receive fluid displaced from a substrate vertically positioned within the spin dryer. The shielding system has one or more shields 213, 215 and 217, positioned to at least partially reflect fluid therefrom as the fluid impacts the shield. The shield or shields are angled to promote the flow of fluid therealong and are preferably hydrophilic, to prevent droplets from forming. By adding a pressure gradient across the interior of the spin dryer to create an air flow which encourages the fluid to travel along the shielding system in the desired direction.
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