发明名称 NON-CONTACT IC CARD AND ITS MANUFACTURE
摘要 PROBLEM TO BE SOLVED: To realize a non-contact IC card in which such danger that a card base main body is curled by hot pressing performed when an optical diffraction structure transfer layer is provided on the card base main body and also when a rewritable reversible displaying part is provided, is eliminated, and also which has a card base main body capable of enduring sufficiently even though hot pressing of a high temperature is applied when an IC chip is mounted on an anisotropic conductive film and conductive ink, and to realize its manufacturing method. SOLUTION: In this non-contact IC card 1 where a card base main body 2 is formed by laminating a plurality of sheetlike bases, non-contact IC chips 1 and a coil for an antenna are included in the body 2 with the chips 1 and the coil electrically connected, an optical diffraction structure transfer layer 10 is formed on one surface side of the body 2, a rewritable reversible displaying part 7 is also provided on the other surface side, and the plurality of sheetlike bases constituting the body 2 are made of heat resistance bases.
申请公布号 JP2001005934(A) 申请公布日期 2001.01.12
申请号 JP19990174234 申请日期 1999.06.21
申请人 DAINIPPON PRINTING CO LTD 发明人 HONDA SHIKO
分类号 G06K19/07;B42D15/10;G06K19/077;G06K19/08;H01L23/28;H01L25/16 主分类号 G06K19/07
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