| 摘要 |
PROBLEM TO BE SOLVED: To make easily mass-producible an IC card having an excellent characteristic by simplifying the manufacturing process. SOLUTION: A polysilane thin film 20 is formed on one face of a film material 16 formed in the shape of a card and having electric insulation property, a part where a planar coil is formed on the film 20 is shielded from light, and the film 20 is irradiated with ultraviolet ray, oxidizer is next doped on the polysilane thin film to form the part where the ultraviolet ray is shielded into the conductive part 24 of the planar coil 12, subsequently, the coil 12 and a semiconductor element are electrically connected, the semiconductor element 14 is mounted, film material 17 formed in a card shape is stuck to one face side of the material 16, and the coil 12 and the element 14 are sealed. |
