| 摘要 |
PROBLEM TO BE SOLVED: To obtain a non-contact IC card difficult to generate a shortcircuit between wires even if being formed in a laminate, satisfactory in production yield by making the thermally deforming temp. of the resin coating of an antenna furthermore higher than the higher one of the thermally deforming temp. of an upper sheet and that of a lower sheet and making the thermally decomposing temp. of the resin coating lower than a specific temperature. SOLUTION: In the non-contact IC card, an antenna coil is formed out of a wire 1 with resin coating 2, the thermally deforming temp. of the resin coating 2 is furthermore higher than the higher one of the thermally deforming temp. of an upper sheet and that of a lower sheet (desirably higher by at least 20 deg.C), and thermally decomposing temp. of the resin coating is equal to or lower than 400 deg.C, and also, the thermally deforming temp. of the resin coating is desirably equal to or higher than 150 deg.C. It is desirable that resin constituting the resin coating includes urethane, amide-imide or ester-imide or includes the combination of them. |
