| 摘要 |
PROBLEM TO BE SOLVED: To provide a mounting board which is capable of high speed operation and besides is excellent in heat dissipation and mechanical processability, in a parallel transmission type of optical module of such a constitution that an optical element and an electric element are placed mixedly on a shared mounting board. SOLUTION: When constituting a mounting board by sticking an Si substrate 5 loaded with an optical element 2 such as an LD array or the like to a ceramic board 1, the electric connection to the ceramic board 1 of the optical element 2 is performed through a metallic electrode 9 existing extensively from the surface of the Si substrate to the bottom. A metallic electrode 9 to perform the electric connection to the optical element 2 is made on the Si substrate 5, and the metallic electrode 9 is extended to the bottom of the Si substrate, and it is connected at that section directly to the ceramic board 1, so as compared with a conventional method by wire bonding, highly reliable connection with the wiring inside the ceramic board becomes possible. Moreover, since wire bonding becomes needless, so the crosstalk is dissolved, and it becomes possible to bring the optical element and the electric element close to each other more than before, and the compatibility to a high-speed signal above gigahertz becomes possible. |
