| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic part package junction structure and the junction method in which omission of solid solders, degradation of working efficiency or cost-up of a circuit board can easily be prevented and the solid solders having optimal size, form and material can easily be selected and obtained. SOLUTION: An electronic part package junction structure 20 is provided with an electronic part package 22 which is provided with a number of electrode terminals 23 by aligning in a matrix state on the bottom surface, a printed circuit board 24 on which surface a land electrode 28 being conductive with the electrode terminals 23 is provided, and a solder supporting sheet 26 which is provided between the electronic part package 22 and the printed circuit board 24 and which supports solid solders 30 protruding from both sides toward holes which are made at each position corresponding a number of electrode terminals 23 of the electronic part package 22.
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