| 摘要 |
PROBLEM TO BE SOLVED: To eliminate the need for providing a protective element in a semiconductor element for reduced element area by embedding the protective element for protecting the semiconductor element from electric noise within a carrier tape. SOLUTION: An input lead 1 and output lead 2 are formed on the surface of a tape carrier package, with the tips of the leads 1 and 2 provided with a test pad for selection. The leads 1 and 2 are once developed between a semiconductor element 5 and a pad, and a Schottky diode 6 of a protective element is embedded in the tape of a lead development part 3. In short, a through hole is provided between the input lead 1 on the surface of tape carrier package and ground line, power source line 7, and 8 formed on the rear surface of the tape carrier package with the protective element 6 embedded there. |
