| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayered wiring board which is suited to an electronic circuit board or a package, etc., to which electronic parts such as semiconductor element, etc., that can match characteristic impedance by using an adjacent penetrating conductor and operate at a high speed, are mounted. SOLUTION: This multilayered wiring board is provided with a laminated wiring body in which a second insulation layer I2 having a second parallel wiring group L2 crossing orthogonally a first parallel wiring group L1 is laminated on a first insulation layer I1 having a parallel wiring group L1, and the first and second parallel wiring groups L1 and L2 are connected with a penetrating conductor group T. The first and second parallel wiring groups L1 and L2 are provided respectively with a plurality of signal 1 wirings S1 and S2, and power supply wirings P1 and P2 or ground wirings G1 and G2. Furthermore, the size of a penetrating conductor T1 for signal is made different from that of a penetrating conductor T2 for power supply/grounding, which is adjacent to the conductor T1 and connects the power supply wirings P1 and P2 or ground wirings G1 and G2, to set an impedance of the conductor T1 connecting the signal wirings S1 and S2 at a specified impedance. |
