LEAD TERMINAL STRUCTURE OF WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To easily recognize dislocation between a lead terminal and the bump of a semiconductor chip. SOLUTION: A dummy terminal 7 is so formed as to correspond to a non- used bump 6 on a substrate. The dimension of the dummy terminal 7 in parallel direction is equal to that of the non-used bump 6 in parallel direction. At least one of both end positions of the dummy terminal 7 in orthogonal direction and those of the non-used bump 6 in orthogonal direction as well as the tip end position of the dummy terminal 7 in parallel direction and one end position of the non-used bump 6 in parallel direction is at the same position.