| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a chip capacitor which can intensively use its mounting area and, in addition, can obtain a desired capacitance even when the size of the capacitor is reduced. SOLUTION: The capacitor element 20 of a chip capacitor has a cathode layer 22 around the element 20 and has a flat lower surface 20b. A tantalum wire 24 is protruded outward from the end section 20d of the element 20. A plate-like cathode terminal 28 has facing main surfaces 28a and 28b and the surface 28a is positioned in parallel with the flat surface 20b of the cathode layer 22 under the surface 20b and electrically connected to the surface 20b. A plate-like anode terminal 30 has facing main surfaces 30a and 30b and the surface 30a is positioned in the same plane as that of the main surface 28a of the cathode terminal 28 under the flat surface 20b of the cathode layer 20 and electrically connected to the tantalum wire 24. The capacitor element 20, anode terminal 30, and cathode terminal 28 are coated with a packaging resin 36 in such a way that only the main surfaces 30b and 28b of the terminals 30 and 28 are exposed.</p> |
