| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board of high yield that is easy to form and has an electronic part within. SOLUTION: A wiring board 100 is provided with a core board body 10 that has a plate-like shape provided with a core board body upper surface 10A and a core board body lower surface 10B and provided with a recess 11 recessed from the core board body upper surface 10A, a lot of chip capacitors 24 placed and fixed in the recess 11, and a first conversion layer 60 and a second conversion layer that are formed above the upper surface 10A and the chip capacitor 24 to connect the chip capacitor 24 in parallel. So that the chip capacitor 24 forms a synthetic capacitor of large electrostatic capacity, and noise between ground potential and power supply potential is removed. This method for manufacturing the wiring board is, in placing the chip capacitor 24 in the recess 11, provided with a placing/fixing process wherein a chip capacitor assembly 20 constituted by assembling chip capacitors 24 is formed in advance, and then the assembly 20 is placed and fixed in the recess.</p> |
