| 摘要 |
<p>PROBLEM TO BE SOLVED: To rapidly dechuck a wafer from a chuck by applying a voltage to between the wafer and an electrode. SOLUTION: A hysteretic discharge cycle is carried out, and remaining electric charges are eliminated, a voltage is a damping oscillation waveform, and a damping electric field is supplied to a wafer 114 to chuck a surface interface 120. A shape of an electric field in this interface is extremely imperative for attaining a rapid dechuck at 200 ms or less.</p> |
