| 摘要 |
PROBLEM TO BE SOLVED: To obtain a circuit board which has high mechanical, thermal, and insulation reliability and is suitably used for a power module. SOLUTION: A circuit board is constituted by forming an Al or Al-alloy circuit on one surface of an aluminum nitride substrate and a heat sink on the other surface as necessary. The aluminum nitride substrate is constituted in a multilayered structure by joining nitride aluminum substrates to each other through Al or Al-alloy plates. The thickness of the multilayered structure is adjusted to 1-5 mm and the thickness and deflection strength of each Al or Al-alloy plate are adjusted to 0.1-2 mm and >=400 MPa, respectively.
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