发明名称 MULTILAYER PRINTED WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To obtain a multilayer printed wiring board in which correction record can be grasped intuitively by simply observing the external view by providing correction record information display of each print element integrally with a corresponding print element, when it is placed on an insulating board, such that it can be confirmed visually from the outside even after the print elements are disposed on the insulating board. SOLUTION: A print element 12 comprising a wiring layer of a required conductive pattern is formed by etching, or the like, around an insulating board 10 of transparent or semi-transparent material having translucence, e.g. glass base epoxy resin, and a plurality of single layer boards 22 are prepared and hot pressed while being aligned accurately. Utilizing a design software of the print element in a specified computer, symbols 14 for indicating record information is embedded as a part of the print element 12 when a print element 12 required for a wiring layer is designed on a display thus forming a required symbol 14 on the insulating board 10 simultaneously with the print element 12 using a material for forming the print element 12.
申请公布号 JP2001007459(A) 申请公布日期 2001.01.12
申请号 JP19990172849 申请日期 1999.06.18
申请人 DIGITAL ELECTRONICS CORP 发明人 KANO MAKOTO
分类号 H05K1/02;(IPC1-7):H05K1/02 主分类号 H05K1/02
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