| 摘要 |
<p>When a photomask (1PA1) is installed in a predetermined apparatus such as an inspection apparatus or an exposure apparatus, the photomask (1PA1) is inspected or exposed while the area where no light-shielding pattern (1b) nor mark pattern (1mr) formed of a resist film is present on a major surface of the mask base (1a) of the photomask (1PA1) is in contact with an installation part (2) of the predetermined apparatus. Thus, in a method for manufacturing a semiconductor integrated circuit device by using a photomask for allowing a resist film to serve as a light-shielding film, few or no foreign matters are produced.</p> |
