| 摘要 |
An electronic part (X) formed of conductive plate and provided with a plurality of leads (1, 2) each having an island (10) on which a semiconductor chip (3) is mounted, or a connecting portion (20) to which a wire (4) is connected. In the electronic part (X), at least a set of leads (1, 2) disposed adjacent each other are such that opposed lateral surfaces (10a, 20a) are nonparallel. Preferably, at least one lateral surface (10a, 20a) of the leads (1, 2) has, at least in a portion thereof, a curved surface, bend surface or inclined surface or a portion that is a combination thereof. |
