| 发明名称 |
Planar LED assembly on thermally-conductive board, increases cooling, component packing density and life, whilst permitting active device integration to form display- or illumination panel in or on e.g. vehicle |
| 摘要 |
The board comprises a material having thermal conductivity exceeding 1 W/Kxm, preferably exceeding 1.5 W/Kxm. |
| 申请公布号 |
DE19931689(A1) |
申请公布日期 |
2001.01.11 |
| 申请号 |
DE1999131689 |
申请日期 |
1999.07.08 |
| 申请人 |
PATENT-TREUHAND-GESELLSCHAFT FUER ELEKTRISCHE GLUEHLAMPEN MBH |
发明人 |
BIEBL, ALOIS;HIRSCHMANN, GUENTHER |
| 分类号 |
H01L23/36;F21V29/00;H01L25/075;H01L25/16;H01L33/48;H01L33/64 |
主分类号 |
H01L23/36 |
| 代理机构 |
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代理人 |
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