PRINTED WIRING BOARD AND PREPREG FOR PRINTED WIRING BOARD

摘要

A prepreg (1) comprises a matrix having a mass of 30 g/m<2> or less and an E glass cloth (2) made by weaving fiber bundles of 120 or less glass filaments and having a fluorocarbon resin layer (3) formed by impregnating the cloth (2) with a fluorocarbon resin such as PTFE. A fluorocarbon resin adhesion impregnation layer (7) of, e.g., PFA is formed over one or both of sides of the prepreg (1). A cupper foil (5) is provided over the fluorocarbon resin adhesion impregnation layer (7), and a predetermined conductor pattern is formed on the surface of the cupper foil (5). Thus, a printed wiring board having a thickness of 0.2 mm or less is manufactured. Such a printed wiring board is excellent in dielectric characteristics, electrical conductivity between through holes, long-term reliability, and flexibility, and can be applied to various uses such as high-frequency circuit.