发明名称 |
SEMICONDUCTOR MANUFACTURE EQUIPMENT, AND METHOD AND APPARATUS FOR SEMICONDUCTOR MANUFACTURE |
摘要 |
Semiconductor manufacture equipment is provided in which the thermal load in a clean room (1) is decreased to reduce energy consumption. An apparatus (12) for semiconductor manufacture that dissipates heat during operation is enclosed in a case (11) and placed in a clean room (1). In the clean room (1), air can enter the case (11) and leave through exhaust ports (24, 25). The case (11) includes a heat insulator (4) to prevent the heat transfer from the case (11) to the air in the clean room. Alternatively, between the case (11) and the apparatus (12) is defined a sealed space, into which air is introduced from the outside of the clean room (1) through an intake port (71) provided in the case (11).
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申请公布号 |
WO0103167(A1) |
申请公布日期 |
2001.01.11 |
申请号 |
WO2000JP04311 |
申请日期 |
2000.06.29 |
申请人 |
TOKYO ELECTRON LIMITED;TAISEI CORPORATION;OHMI, TADAHIRO;SUENAGA, OSAMU;KOBAYASHI, SADAO |
发明人 |
OHMI, TADAHIRO;SUENAGA, OSAMU;KOBAYASHI, SADAO |
分类号 |
H01L21/00;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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