发明名称 SEMICONDUCTOR MANUFACTURE EQUIPMENT, AND METHOD AND APPARATUS FOR SEMICONDUCTOR MANUFACTURE
摘要 Semiconductor manufacture equipment is provided in which the thermal load in a clean room (1) is decreased to reduce energy consumption. An apparatus (12) for semiconductor manufacture that dissipates heat during operation is enclosed in a case (11) and placed in a clean room (1). In the clean room (1), air can enter the case (11) and leave through exhaust ports (24, 25). The case (11) includes a heat insulator (4) to prevent the heat transfer from the case (11) to the air in the clean room. Alternatively, between the case (11) and the apparatus (12) is defined a sealed space, into which air is introduced from the outside of the clean room (1) through an intake port (71) provided in the case (11).
申请公布号 WO0103167(A1) 申请公布日期 2001.01.11
申请号 WO2000JP04311 申请日期 2000.06.29
申请人 TOKYO ELECTRON LIMITED;TAISEI CORPORATION;OHMI, TADAHIRO;SUENAGA, OSAMU;KOBAYASHI, SADAO 发明人 OHMI, TADAHIRO;SUENAGA, OSAMU;KOBAYASHI, SADAO
分类号 H01L21/00;(IPC1-7):H01L21/02 主分类号 H01L21/00
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