| 摘要 |
A modular jack (10) mountable to a circuit board (12), with a bottom section (50) of a housing (32) forwardly of solder tails (38) of contacts (36) thereof, being disposed within a recess (52) in the circuit board, whereby the height of the top surface of the jack above the circuit board is minimized without reducing the size of the plug-receiving cavity (30) of the jack. |
