| 摘要 |
<p>An apparatus for etching a substrate, comprises a container (102), a substrate support (104) disposed in the container; a rotation actuator (120) attached to the substrate support; and a fluid delivery assembly (106) disposed in the container to deliver an etchant to a peripheral portion of a substrate (122) disposed on the substrate support. Preferably, the substrate support comprises a vacuum chuck (124) and the fluid delivery assembly comprises one or more nozzles (150). A method for etching a substrate is also disclosed, comprising, rotating a substrate positioned on a rotatable substrate support; and delivering an etchant to a peripheral portion of the substrate. Preferably, the substrate is rotated at between about 100 rpm and about 1000 rpm, and the etchant is delivered in a direction that is substantially tangent to the peripheral portion of the substrate at an incident angle between about 0 degrees and about 45 degrees from a surface of substrate. <IMAGE></p> |
