| 摘要 |
PROBLEM TO BE SOLVED: To provide a compact and inexpensive device for chamfering an outer circumferential portion of a thin disklike work to carry out a method for chamfering the outer circumferential portion of the thin disk-like work with short chamfering time. SOLUTION: In this device for chamfering an outer circumferential portion of a thin disklike work, a thin disk-like work W is rotated about its axis, an outer circumferential surface of a grinding wheel 1 is pressed against the outer circumferential surface of the work while the columnar grinding wheel 1 is rotated about its axis to chamfer the outer circumferential part of the work W. A groove 2 is formed over the whole length of the outer circumferential surface of the grinding wheel 1. The groove 2 is smaller toward a bottom, and a bottom surface of the groove 2 is of a recessed curved surface. The work W and the grinding wheel 1 are arranged so that the axis Sw of the work W is located on one of two parallel planes, and the axis S1 of the grinding wheel 1 is located on the other, and both axes are not parallel to each other. A driving device to adjust the distance between the axis Sw of the work W and the axis S1 of the grinding wheel 1 is provided.
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