| 摘要 |
PROBLEM TO BE SOLVED: To provide an edge polishing device and an edge polishing method capable of improving and stabilizing the polishing speed, and increasing the service life of a polishing pad. SOLUTION: In a wafer edge polishing device comprising a rotary drum 2 to a surface of which a polishing pad 1 is attached, a wafer rotating device to press its end face against the rotary drum 2 at a specified angle while rotating a wafer 3, and a nozzle 7 to feed a polishing solution to a contact part of the wafer with the polishing pad, the polishing pad is a sheet of a multi- layered structure in which a sheet 11 comprising at least one of a synthetic resin foam, a non-woven fabric, a resin-worked non-woven fabric, a synthetic leather or a composite product thereof is combined with a sheet 12 of 50-500 kgf/cm2 in compressive modulus of elasticity. |
