| 摘要 |
PROBLEM TO BE SOLVED: To provide a new method for producing a semiconductor substrate having a surface metallurgy-feature free from defects as a whole. SOLUTION: Concretely, a ceramic green sheet laminated material, whose surface is protected, is obtained by using at least one surface layer being thermally depolymerized. Further concretely, before laminating, a surface film being thermally depolymerized or decomposed is put on a stack or assembly of the ceramic green sheets and adjusted to fit to the surface form of the green sheets 20 during laminating. Thereafter, the green sheet laminated material 65 having the protected surface can be sized or diced without forming defects. Since the thermally depolymerizable or decomposable film is thermally depolymerized and removed by firing in the sintering process, the film is easily and completely removed and thereby a ceramic substrate having the surface free from defects can be obtained. |
