| 摘要 |
PROBLEM TO BE SOLVED: To prevent the uneven polishing generated in CMP. SOLUTION: This carrier head for the chemical and mechanical polishing comprises a base 104, a first flexible film 118 extended below the base to form a first compressible chamber, a support structural body 114 arranged in a first chamber 120, and a compressible film 180 adjacent to a bottom surface of the support structural body. A substrate mounting surface is provided on a lower side of the first flexible film 118. The compressible film 180 has a plurality of openings arranged in a pattern to establish the pressure distribution on the upper side of the first flexible film 118. |
