| 摘要 |
PROBLEM TO BE SOLVED: To improve drop impact resistance by specifying a Zn content to a specified value or lower in the material consisting of a specified quantity of Cu, Ag, Pb, Sn. SOLUTION: In the solder having a composition of consisting of, by weight, 0.10-2.0% Cu, 0.10-5.0% Ag, 0.001-1.0% Pb and the balance Sn, a Zn content in the composition is set to <=0.1. Or in the solder having a composition of consisting of, by weight, 0.50-0.9% Cu, 0.25-0.50% Ag, 0.005-0.9% Pb and the balance Sn, a Zn content in the composition is set to <=0.1. By using these solders and performing micro-joining of an electronic member and a substrate, the excellent property in drop impact resistance is exhibited. Accordingly, an electronic part suitable for a portable small electronic device of, e.g. audio device, camera, video camera is provided. |
