| 发明名称 |
Thermal conditioning apparatus |
| 摘要 |
A method of disposing a wafer on a support member protruding from a surface. The method includes supporting the wafer in a first position defined by a lift extending through the surface and manipulating the surface to place the wafer on the support member.
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| 申请公布号 |
US6171402(B1) |
申请公布日期 |
2001.01.09 |
| 申请号 |
US19990250484 |
申请日期 |
1999.02.12 |
| 申请人 |
MICRON TECHNOLOGY, INC. |
发明人 |
STRODTBECK TIMOTHY A.;MOLEBASH JOHN S.;HAYES BRUCE L.;SMITH REX A.;DAVIS SHAWN D. |
| 分类号 |
B25B11/00;H01L21/00;H01L21/687;(IPC1-7):B05C13/02 |
主分类号 |
B25B11/00 |
| 代理机构 |
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| 地址 |
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