发明名称 |
Structure of stacked barrier layer |
摘要 |
A structure of a stacked barrier layer is provided. A first titanium layer is formed on a semiconductor substrate using plasma enhanced chemical vapor deposition (PECVD). At least a stacked barrier layer is formed on the first titanium layer. The stacked barrier layer includes a first titanium nitride layer and a plasma treated titanium nitride layer. The plasma treated titanium nitride layer is treated using a plasma gas including ammonia gas and nitrogen gas.
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申请公布号 |
US6171717(B1) |
申请公布日期 |
2001.01.09 |
申请号 |
US19980181303 |
申请日期 |
1998.10.28 |
申请人 |
UNITED MICROELECTRONICS CORP. |
发明人 |
CHANG TING-CHANG;HU JUNG-CHIH |
分类号 |
H01L21/768;(IPC1-7):B32B18/00 |
主分类号 |
H01L21/768 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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